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Book Cover
Title Copper wire bonding / Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht.
Publication Info. New York : Springer, [2014]

Location Call No. Status Notes
 Libraries Electronic Books  ELECTRONIC BOOKS-DDA    AVAIL. ONLINE
Description 1 online resource.
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Contents Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding.
Bibliography Includes bibliographical references and index.
Reproduction Electronic reproduction. Perth, W.A. Available via World Wide Web.
Note Description based on online resource; title from PDF title page (SpringerLink, viewed September 24, 2013).
Subject Wire bonding (Electronic packaging)
Copper wire.
Added Author Chauhan, Preeti S., author.
Ebooks Corporation
ISBN 9781461457619 (electronic bk.)
1461457610 (electronic bk.)
UPC # 10.1007/978-1-4614-5761-9 doi
OCLC # EBC1466618
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