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Book Cover
Title Electromigration modeling at circuit layout level [electronic resource] / Cher Ming Tan, Feifei He.
Publication Info. Singapore ; New York : Springer, c2013.

Location Call No. Status Notes
 Libraries Electronic Books  ELECTRONIC BOOKS-DDA    AVAIL. ONLINE
Description 1 online resource.
Series SpringerBriefs in applied sciences and technology Reliability.
Contents Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performances in Circuit and Test Structures -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Concluding Remarks.
Bibliography Includes bibliographical references.
Reproduction Electronic reproduction. Perth, W.A. Available via World Wide Web.
Subject Integrated circuits -- Reliability.
Electrodiffusion -- Simulation methods.
System safety.
Quality Control, Reliability, Safety and Risk.
Electronic Circuits and Devices.
Atomic, Molecular, Optical and Plasma Physics.
Added Author He, Feifei.
Ebooks Corporation
ISBN 9789814451215 (electronic bk.)
9814451215 (electronic bk.)
OCLC # EBC1206437
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