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Title Advanced flip chip packaging [electronic resource] / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.
Publication Info. New York ; London : Springer, 2013.

Location Call No. Status Notes
 Libraries Electronic Books  ELECTRONIC BOOKS-DDA    AVAIL. ONLINE
Description 1 online resource.
Reproduction Electronic reproduction. Perth, W.A. Available via World Wide Web.
Note Description based on print version record.
Subject Flip chip technology.
Electronic packaging.
Added Author Tong, Ho-Ming.
Lai, Yi-Shao.
Wong, C. P.
Ebooks Corporation
Related To Print version: Advanced flip chip packaging. New York ; London : Springer, 2010 9781441957672
ISBN 9781441957689 (electronic bk.)
1441957685 (electronic bk.)
OCLC # EBC1081684
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