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Title Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.
Publication Info. Weinheim, Germany : Wiley-VCH, 2012.
Location Call No. Status Notes
 Libraries Electronic Books  ELECTRONIC BOOK-ebrary    AVAIL. ONLINE
Description xxxi, 395 p. : col. ill.
Bibliography Includes bibliographical references and index.
Contents pt. 1. Technologies -- pt. 2. Applications.
Reproduction Electronic reproduction. Palo Alto, Calif. : ebrary, 2011. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.
Subject Semiconductors -- Bonding -- Handbooks, manuals, etc.
Semiconductor wafers.
Microelectromechanical systems -- Design and construction.
Added Author Ramm, Peter.
Lu, James Jian-Qiang.
Taklo, Maaike M. V.
ebrary, Inc.
ISBN 9783527326464
9783527644247 (e-book)
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