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Book Cover
EBOOK
Title Advanced thermal management materials [electronic resource] / Guosheng Jiang, Liyong Diao, Ken Kuang.
Publication Info. New York, NY : Springer, c2013.

Location Call No. Status Notes
 Libraries Electronic Books  ELECTRONIC BOOKS-DDA    AVAIL. ONLINE
Description 1 online resource.
Bibliography Includes bibliographical references and index.
Reproduction Electronic reproduction. Perth, W.A. Available via World Wide Web.
Subject Microelectronic packaging -- Materials -- Thermal properties.
Microelectronics -- Cooling.
Heat sinks (Electronics)
Engineering.
Electronics.
Materials.
Electronics and Microelectronics, Instrumentation.
Engineering Thermodynamics, Heat and Mass Transfer.
Metallic Materials.
Added Author Diao, Liyong.
Kuang, Ken.
Ebooks Corporation
ISBN 9781461419631 (electronic bk.)
1461419638 (electronic bk.)
9781461419624
OCLC # EBC1030885
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